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IPC-7711/7721 training is an advanced soldering course for anyone responsible for quality control of refurbished or repaired electronics. Students will learn IPC-approved procedures, requirements, tools, materials, and methods to be used in the modification, rework, and repair of printed circuit board assemblies. Lead-free standards and best materials for rework are included in this class. A large portion of this class involves Hands-on lab work.
- Module 1 – Common Practices. This module covers all the basic skills required to repair and rework circuit boards. This covers the skill levels needed; the level of conformance the finished product will need to achieve and the common terminology used.
- Module 2 – 7711 – Splices. The module covers various techniques for splices. This covers soldered splices and heat shrink protective coverings.
- Module 3 – 7711 – Conformal Coatings. This module goes into the details of identifying which conformal coating your PCA has and how to properly remove that coating so the board can be repaired. It then covers the correct way to replace and validate the coating.
- Module 4 – 7711 -Through-hole component technology This module covers the removal and replacement of through-hole components. Several different methods are covered for removal and replacement of these parts.
- Module 5 – 7711 – Chip component & MELFs. This module covers the removal and replacement of chip components and metal electrode headless face (MELF) parts. Several different methods are covered for removal and replacement of these parts
- Module 6 – 7711 – Gull Wing Components. This module covers the removal and replacement of gull-wing components. Several different methods are covered for removal and replacement of these parts
- Module 7 – 7711 – J-Lead Components. This module covers the removal and replacement of J-lead components. Several different methods are covered for removal and replacement of these parts.
- Module 8 – 7711 – BGAs. This is an optional module. Due to the very specialized equipment required to place, attach and inspect these components, we do not offer this module.
- Module 9 – 7721 – Laminate Repair. This module details multiple procedures for repairing damaged PCB laminate materials. This includes burns, gouges, scratches; damaged keyways and edges. Use of epoxies, bonding agents and dyes is covered.
- Module 10 – 7721 – Circuit Repair This module covers multiple processes for repairing and replacing damaged lands, pads, eyelets and traces.
Advanced Hands-On Soldering Lab (HST)
Our advanced hands-on soldering course teaches students to recognize the five steps that need to happen every time before you begin the soldering process. Each of these steps assures that the technician knows the important questions about the materials they are using in the soldering process, from choosing the correct solder to correct cleaning methods.
Our unique approach to teaching insures successful soldering practices that meets NASA quality solder connections every time. Our copywrite 5 T’s process will give you the tools to create NASA quality solder connections every time you solder. This course is “hands-on”! You will get to use some of the best soldering stations and equipment in the industry to refine your skills. There is no reason why a technician shouldn’t be producing Class 3 IPC quality workmanship all the time.
Each class is customized based on our customer’s needs. This class can be structured from a one day refresher class to a five day intensive class. Some clients bring in specific projects they are working on; others use our significant array of components to build their proficiency.
- Lecture Module – This module goes into the step-by-step details of what is required to create a Class 3+ solder connection. We’ll cover the tools, materials and processes that are required in today’s hi-tech industries. Solder stations, solder tips, solder alloys, fluxes, hand tools and inspection processes are covered. R.O.H.S. and standards are discussed as well.
- Equipment/Tools Module – This module covers the maintenance and safety aspects of the equipment used. Proper care for the equipment is key for consistent high quality solder joints.
- Through-Hole Module – This module starts with the basics of lead forming and component mounting and clinching basics. The proper use of flux; the correct tip shape and size; and several other factors are all covered to get perfect results.
- Large Chip Components Module – This module covers the placement and soldering of 2,3 and 5 sided chip components. Several different methods are covered for placing and soldering these parts; mainly 1206; 0805 and 0603 parts.
- J-Lead/Gull Wing Component Module – This module covers placement and soldering of J-lead and gull wing components.
- Fine Pitch Component Module*** – This module covers placement and soldering of fine pitch (25 mil or less spacing) J-lead and gull wing components.
- Small/Micro Chip Components Module*** – This optional module covers the use of solder paste as well as non-standard solder alloys such as K100LD and SN100C. Specialized tools such as hot air stations and pre heating tables are utilized.
- Exotic Materials Soldering Module*** – This optional module covers the use of solder paste as well as non-standard solder alloys such as K100LD and SN100C. Specialized tools such as hot air stations and pre heating tables are utilized.
*** Optional module that is not part of the basic Advanced Hands-On Soldering course.
Advanced Hands-On Cable/Wire Harness Lab (HC/WT)
This course covers all the basics of creating a class 3+ wire harness. Defects in wiring harnesses is one of the biggest problems in the electronics industry today. This course will teach the student to interpret drawings and build Cable/Wire harness bundles. This is a Hands-on lab.
- Lecture Module – This module covers all the basic tools and processes needed to assemble acceptable wire harnesses. We’ll cover the anatomy of a wire terminal, the tools used to make good terminations, and the process for quality verification.
- Equipment/Tools Module – This module covers wire strippers; cutting tools; solder pots; solder stations; vices and holding tools and test equipment.
- Wire Preparation Module – This module starts with the basics of stripping and tinning (if required), and measuring the wires. Wire boards for harness assembly and measuring tools will be demonstrated.
- Soldered Terminal Module – Various styles of soldered terminations will be covered with the emphasis on solder cup terminals.
- Open/Closed Barrel Termination Module – This module covers the most common terminal style; the stamped and formed open barrel terminal. This terminal has 10 different inspection points; several which are critical to its performance.
- Machine Contact Module – The machine contact is a high performance terminal which is most commonly used in military and aviation applications. This requires very specialized terminal crimping tools and exacting strip lengths.
- Protective Coverings Module – This module covers the various styles of harness protective coverings used such as braided nylon, split loom, raceways, tapes and heat shrink tubing.
- Connectorization Module – This module covers the process of installing and dressing the wires for the end cover, strain relief and boot to be installed.
- Securing – Lacing Module*** – This optional module is entirely based on NASA wire harness lacing standards which covers continuous lacing; spot lacing and all the specialized knots required. This is commonly used in aviation, space and military applications.
- Coaxial Cable Module*** – This optional module covers various coaxial cable terminations.
- Insulation Displacement Connector (IDC) Module*** – This optional module covers various style and applications if IDC terminations. Flat ribbon cable and RJ45 terminals are used.
- Destructive/Non-destructive Testing*** – This optional module goes in depth into using measuring tools to verify crimp accuracy. Crimp height measuring calipers and retention force testers are used. We will also do destructive testing using a pull force tester to measure failure levels at the termination crimp.
- Splicing*** – This optional module covers multiple different methods for making acceptable repair and modification spices. Heat shrinkable solder devices (HSSD); butt crimp splices; ferrel crimps and soldered splices are used.
*** Optional module that is not part of the basic Advanced Hands-On Soldering course.